Package on a package
integrated circuit packaging method
Package on a package, or package on package (PoP), is an integrated circuit packaging method to vertically combine ball grid array (BGA) packages for discrete logic and memory. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. PoP allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of being slightly taller. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations.
Configuration
Two widely used configurations exist for PoP:
Pure memory stacking: two or more memory only packages are stacked on each other
Mixed logic-memory stacking: logic (CPU) package on the bottom, memory package on top. For example, the bottom could be a system on a chip (SoC) for a mobile phone. The logic package is on the bottom because it needs many more BGA connections to the motherboard.
During PCB assembly, the bottom package of a PoP stack is placed directly on the PCB, and the other package(s) of the stack are stacked on top.
The packages of a PoP stack become attached to each other (and to the PCB) during reflow soldering.
The public source identifies “Package on a package” as integrated circuit packaging method. This brief keeps that definition visible, then builds a research path around Package, package and integrated.
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Vocabulary and entity names are the principal evidence signals here, because they determine the precision of every later search. The source revision retrieved here is dated Mar 27, 2026. The linked authority identifier is Q130652. None of the 0 selected statements returned an explicit reference.
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This entry incorporates text from “Package on a package” on English Wikipedia. Contributors are listed in the page history. Text is available under the Creative Commons Attribution-ShareAlike 4.0 License. Selected authority identifiers and statements are retrieved from Wikidata under CC0; their references and qualifiers remain part of the verification path.