Through-hole technology
mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards and soldered to pads on the opposite side manually or by automated insertion mount machines

In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines.
History
Through-hole technology almost completely replaced earlier electronics assembly techniques such as point-to-point construction. From the second generation of computers in the 1950s until surface-mount technology (SMT) became popular in the mid-1980s, every component on a typical PCB was a through-hole component. PCBs initially had tracks printed on one side only, later both sides, then multi-layer boards were in use. Through holes became plated-through holes (PTH) in order for the components to make contact with the required conductive layers. Plated-through holes are no longer required with SMT boards for making the component connections, but are still used for making interconnections between the layers and in this role are more usually called vias.
Leads
Axial and radial leads
Components with wire leads are generally used on through-hole boards. Axial leads protrude from each end of a typically cylindrical or elongated box-shaped component, on the geometrical axis of symmetry. Axial-leaded components resemble wire jumpers in shape, and can be used to span short distances on a board, or even otherwise unsupported through an open space in point-to-point wiring. Axial components do not protrude much above the surface of a board, producing a low-profile or flat configuration when placed "lying down" or parallel to the board.
Begin with the source’s own compact description: “Through-hole technology” is mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards and soldered to pads on the opposite side manually or by automated insertion mount machines. The dossier treats that line as a proposition to test through Through-hole, technology and mounting, not as a finished interpretation.
Why this record matters
The phrase “mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards and soldered to pads on the opposite side manually or by automated insertion mount machines” supplies a clear boundary for inquiry. It also exposes the unanswered questions: who defined that boundary, when it became stable and which sources sit outside it.
The citation trail is more important than the brevity of the summary: it shows where individual claims can be examined in context. The source revision retrieved here is dated Jul 7, 2026. The linked authority identifier is Q1004377. None of the 0 selected statements returned an explicit reference.
Overview language is designed for orientation and should not be treated as a substitute for the evidence cited beneath it. The lead is largely declarative, so disagreement and counter-evidence require a deliberate search beyond the opening account. Authority statements aid reconciliation but still require their own references, qualifiers and ranks to be checked.
How to read it
Use the entry as an orientation point, then follow its citations and revision history. Names, dates and institutional relationships should be checked against the original record.
- Subject orientation
- Search vocabulary
- Locating named sources
The closest primary source, responsible institution and strongest cited specialist reference.
Three-step research path
- Establish the record: confirm the title “Through-hole technology”, its source revision and the description used here.
- Expand the search: follow Through-hole technology primary sources, Through-hole technology archive and Through-hole research across catalogues and specialist indexes.
- Test the account: compare the strongest cited source with the responsible institution’s current record and note any disagreement.
Questions for further research
- Which source most directly establishes the central claim about “Through-hole technology”?
- Which cited source is closest to the event, object or claim?
- What terminology or title could unlock a more precise catalogue search?
Search terms from this dossier
This entry incorporates text from “Through-hole technology” on English Wikipedia. Contributors are listed in the page history. Text is available under the Creative Commons Attribution-ShareAlike 4.0 License. Selected authority identifiers and statements are retrieved from Wikidata under CC0; their references and qualifiers remain part of the verification path.