Co-fired ceramic
Integrated circuit package made out of fired ceramic material
Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. The technology is also used for robust assembly and packaging of electronic components multi-layer packaging in the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.
Co-fired ceramic devices are fabricated using a multilayer approach. The starting material is composite green tapes, consisting of ceramic particles mixed with polymer binders. The tapes are flexible and can be machined, for example, using cutting, milling, punching and embossing. Metal structures can be added to the layers, commonly using filling and screen printing. Individual tapes are then bonded together in a lamination procedure before the devices are fired in a kiln, where the polymer part of the tape is combusted and the ceramic particles sinter together, forming a hard and dense ceramic component.
Co-firing can be divided into low-temperature (LTCC) and high-temperature (HTCC) applications: low temperature means that the sintering temperature is below 1,000 °C (1,830 °F), while high temperature is around 1,600 °C (2,910 °F). The lower sintering temperature for LTCC materials is made possible through the addition of a glassy phase to the ceramic, which lowers its melting temperature.
“Co-fired ceramic” enters the record as integrated circuit package made out of fired ceramic material. Crown Archives preserves that source wording while asking what Co-fired, ceramic and Integrated can confirm, complicate or overturn.
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