Die (integrated circuit)
naked single chip, microchip or semiconductor chip - e.g. transistor chip - or IC chip.
In the context of integrated circuits, a die (or silicon die) is a block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
There are three commonly used plural forms: dice, dies, and die. To simplify handling and integration onto a printed circuit board, most dies are packaged in various forms.
Manufacturing process
Most dies are composed of silicon and used for integrated circuits. The process begins with the production of monocrystalline silicon ingot. These ingots are then sliced into disks with a diameter of up to 300 mm.
These wafers are then polished to a mirror finish before going through photolithography.
The public source identifies “Die (integrated circuit)” as naked single chip, microchip or semiconductor chip - e.g. transistor chip - or IC chip. This brief keeps that definition visible, then builds a research path around integrated, circuit and naked.
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This entry incorporates text from “Die (integrated circuit)” on English Wikipedia. Contributors are listed in the page history. Text is available under the Creative Commons Attribution-ShareAlike 4.0 License. Selected authority identifiers and statements are retrieved from Wikidata under CC0; their references and qualifiers remain part of the verification path.