List of AMD processors with 3D graphics
Wikimedia list article
This is a list of microprocessors designed by AMD containing a 3D integrated graphics processing unit (iGPU), including those under the AMD APU (Accelerated Processing Unit) product series.
Features overview
The following table shows features of AMD's processors with 3D graphics, including APUs.
Graphics API overview
The following table shows the graphics and compute APIs support across ATI/AMD GPU microarchitectures. Note that a branding series might include older generation chips.
Desktop processors with 3D graphics
APU or Radeon Graphics branded
Lynx: "Llano" (2011)
Socket FM1
CPU: K10 (also Husky or K10.5) cores with an upgraded Stars architecture, no L3 cache
L1 cache: 64 KB Data per core and 64 KB Instruction cache per core
L2 cache: 512 KB on dual-core, 1 MB on tri- and quad-core models
MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, Cool'n'Quiet, AMD-V
GPU: TeraScale 2 (Evergreen); all A and E series models feature Redwood-class integrated graphics on die (BeaverCreek for the dual-core variants and WinterPark for the quad-core variants). Sempron and Athlon models exclude integrated graphics.
List of embedded GPU's
Support for up to four DIMMs of up to DDR3-1866 memory
Fabrication 32 nm on GlobalFoundries SOI process; Die size: 228 mm2, with 1.178 billion transistors
5 GT/s UMI
Integrated PCIe 2.0 controller
Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6570, or 6670 discrete graphics card. This is similar to the Hybrid CrossFireX technology available in the AMD 700 and 800 chipset series
Virgo: "Trinity" (2012)
Fabrication 32 nm on GlobalFoundries SOI process
Socket FM2
CPU: Piledriver
L1 Cache: 16 KB Data per core and 64 KB Instructions per module
GPU TeraScale 3 (VLIW4)
Die Size: 246 mm2, 1.303 Billion transistors
Support for up to four DIMMs of up to DDR3-1866 memory
5 GT/s UMI
GPU (based on VLIW4 architecture) instruction support: DirectX 11, Opengl 4.2, DirectCompute, Pixel Shader 5.0, Blu-ray 3D, OpenCL 1.2, AMD Stream, UVD3
Integrated PCIe 2.0 controller, and Turbo Core technology for faster CPU/GPU operation when the thermal specification permits
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM
Sempron and Athlon models exclude integrated graphics
Select models support Hybrid Graphics technology to assist a Radeon HD 7350, 7450, 7470, 7550, 7570, 7670 discrete graphics card. However, it has been found that this does not always improve 3D accelerated graphics performance.
"Richland" (2013)
Fabrication 32 nm on GlobalFoundries SOI process
Socket FM2
Two or four CPU cores based on the Piledriver microarchitecture
Die Size: 246 mm2, 1.303 Billion transistors
L1 Cache: 16 KB Data per core and 64 KB Instructions per module
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, AVX, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core 3.0, NX bit, PowerNow!
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